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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 专题：武汉轻工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of rapid inducted heating on the microstructure of solder joint in IC 会议论文 19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycling  microstructure  IMC  electronic packaging   Research on microstructures of double interfaces SAC305 solder joint by RPC 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycling  microstructure  IMC  electronic packaging   Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016 作者:  Chen, Jibing*;  Wan, Nang;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycle  solder joint  microstructure  IMC  electronic packaging