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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 1st Electronics Systemintegration Technology Conference 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 期刊论文 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 卷号: 135, 页码: 134-140 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 lead-free solder  ENIG surface finish  intermetallic compound (IMC)   Assessment of lead-free inert gas soldering using a novel reflow technology 会议论文 ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006-01-01 作者:  Ayoade, Oyebode[1];  Cristina, Andersson[2];  Tobias, Hjertkvist[3];  Johan, Liu[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10