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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：山东大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 91, 页码: 316-326 作者:  Li, Xinying;  Gao, Yufei;  Ge, Peiqi;  Zhang, Lei;  Bi, Wenbo 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11 Diamond wire sawing  Photovoltaic polycrystalline silicon  Material  removal mode  Depth of cut   Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 100, 页码: 98-105 作者:  Ge, Mengran;  Zhu, Hongtao;  Ge, Peiqi;  Zhang, Cheng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 Scratching machining  Residual scratch depth  Material removal rate  Elastic deformation   Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 74, 页码: 261-266 作者:  Ge, Mengran;  Zhu, Hongtao;  Huang, Chuanzhen;  Liu, Ao;  Bi, Wenbo 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11 Scratching machining experiment  Material removal mode  Critical  crack-free cutting depth  Micro crack damage   Modeling of surface topography based on relationship between feed per tooth and radial depth of cut in ball-end milling of AISI H13 steel 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 95, 期号: 9-12, 页码: 4199-4209 作者:  Zhang, Qing;  Zhang, Song;  Shi, Wenhao 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Surface topography  Surface roughness  Ball-end milling  Product and  ratio of feed per tooth and radial depth of cut  Material removal rate   Controlled material removal mode and depth of micro cracks in precision grinding of fused silica - A theoretical model and experimental verification 期刊论文 CERAMICS INTERNATIONAL, 2017, 卷号: 43, 期号: 15, 页码: 11596-11609 作者:  Wang, Wei;  Yao, Peng;  Wang, Jun;  Huang, Chuanzhen;  Zhu, Hongtao 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/12 Fused silica  Precision grinding  Brittle to ductile transition  Single  grit scratching   A study on erosion of alumina wafer in abrasive water jet machining 会议论文 17th International Symposium on Advances in Abrasive Technology, ISAAT 2014, 22 September 2014 through 25 September 2014 作者:  Wang, Yong;  Zhu, Hong Tao;  Huang, Chuan Zhen;  Wang, Jun;  Yao, Peng 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/31 Abrasive waterjet  Alumina ceramic wafer  Erosion depth  Material removal rate  Surface roughness   Research on Microscopic Grain-workpiece Interaction in Grinding through Micro-cutting Simulation, part 2: Factorial Study 期刊论文 ADVANCES IN ABRASIVE TECHNOLOGY XII, 2009, 卷号: 76-78, 页码: 15-20 作者:  Yan, Lan;  Li, Xuekun;  Jiang, Feng;  Zhou, Zhixiong;  Rong, Yiming 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/26 single grain cutting  finite element method (FEM)  (specific) cutting  force  material removal rate  critical depth of cut  shear angle