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	Enhanced photocatalytic activity with a heterojunction between BiVO4 and BiOI 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 721, 页码: 784-794 Shan, Lianwei; Liu, Yuteng; Bi, Jingjing; Suriyaprakash, Jagadeesh; Han, Zhidong 收藏 \| 浏览/下载：50/0 \| 提交时间：2017/08/17 Bismuth vanadate Bismuth oxyiodide Photocatalyst Band alignment Photocatalytic activity
	Solar light driven pure water splitting of B-doped BiVO4 synthesized via a sol-gel method 期刊论文 Journal of Alloys and Compounds, 2015, 卷号: 636, 页码: 131-137 L. W.; Wang Shan, G. L.; Suriyaprakash, J.; Li, D.; Liu, L. Z.; Dong, L. M. 收藏 \| 浏览/下载：40/0 \| 提交时间：2015/05/08 Photoelectrochemical BiVO4 XPS Boron doping photocatalytic activity monoclinic bivo4 bismuth vanadate tio2 boron oxidation degradation photoanodes film performance
	Theoretical calculation of the mixing enthalpies of 21 IIIB-IVB, IIIB-VB and IVB-VB binary alloy systems 期刊论文 Physics of Metals and Metallography, 2013, 卷号: 114, 期号: 6, 页码: 457-468 B. W. Zhang; S. Z. Liao; X. L. Shu; H. W. Xie; X. J. Yuan 收藏 \| 浏览/下载：31/0 \| 提交时间：2013/12/24 B binary metal alloys formation/mixing enthalpies systematic theoretical calculations subregular model thermodynamic properties laves phases rare-earth intermetallic compounds solid-electrolyte metal-alloys liquid pb model sn bismuth
	Multiferroic and magnetoelectric properties of single-phase Bi(0.85)La(0.1)Ho(0.05)FeO(3) ceramics 期刊论文 Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 19, 页码: 5908-5912 X. Q. Zhang; Y. Sui; X. J. Wang; J. H. Mao; R. B. Zhu; Y. Wang; Z. Wang; Y. Q. Liu; W. F. Liu 收藏 \| 浏览/下载：10/0 \| 提交时间：2012/04/13 Multiferroic BiFeO(3) Substitution Magnetoelectric coupling bismuth ferrite thin-film bifeo3 polarization
	Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature 期刊论文 Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 449-454 H. F. Zou; Q. K. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：9/0 \| 提交时间：2012/04/13 solder joints interfacial embrittlement single-crystal interconnect segregation tensile bismuth
	Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文 Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 5, 页码: 1785-1789 T. Y. Kang; Y. Y. Xiu; C. Z. Liu; L. Hui; J. J. Wang; W. P. Tong 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/04/13 Bi segregation Interconnect Kinetics Intermetallic compound growth lead-free solders cu
	Structural evolution and physical properties of Bi(1-x)Gd(x)FeO(3) ceramics 期刊论文 Acta Materialia, 2010, 卷号: 58, 期号: 10, 页码: 3701-3708 J. B. Li; G. H. Rao; Y. Xiao; J. K. Liang; J. Luo; G. Y. Liu; J. R. Chen 收藏 \| 浏览/下载：9/0 \| 提交时间：2012/04/13 Bi-based magnetoelectric perovskites Crystal structure Phase transformation X-ray diffraction ferroelectric properties magnetic-properties room-temperature bismuth ferrite bifeo3 films perovskites diffraction chemistry crystal
	Strong magnetoelectric coupling in multiferroic BiFeO(3)-Pb(Zr(0.52)Ti(0.48))O(3) composite films derived from electrophoretic deposition 期刊论文 Applied Physics Letters, 2008, 卷号: 93, 期号: 19 Y. J. Wu; J. G. Wan; C. F. Huang; Y. Y. Weng; S. F. Zhao; J. M. Liu; G. H. Wang 收藏 \| 浏览/下载：14/0 \| 提交时间：2012/04/13 bismuth compounds composite materials electrophoretic coating techniques lead compounds magnetic particles magnetic thin films magnetoelectric effects multiferroics nanoparticles ferroelectric polarization room-temperature bifeo3 ceramics domains
	Inhibition of interfacial embrittlement at SnBi/Cu single crystal by electrodeposited Ag film 期刊论文 Journal of Materials Research, 2008, 卷号: 23, 期号: 1, 页码: 78-82 Q. S. Zhu; Z. F. Zhang; Z. G. Wang; J. K. Shang 收藏 \| 浏览/下载：7/0 \| 提交时间：2012/04/13 copper grain-boundaries solder joints bismuth segregation cu interconnect growth
	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：12/0 \| 提交时间：2012/04/13 CBGA thermal cycling FEM assembly cracking solder joint reliability level reliability flex-substrate interconnect snagcu bga segregation packages behavior bismuth

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