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Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2017, 卷号: 32, 页码: 3555-3563
作者:  Zhao, Ning;  Deng, Jianfeng;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6
作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Zhao N(赵宁);  Huang ML(黄明亮);  Ma HT(马海涛)
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Zhao N(赵宁)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 卷号: 26, 页码: 933-942
作者:  Huang, M. L.;  Yang, F.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 卷号: 26, 页码: 345-352
作者:  Zhao, N.;  Huang, M. L.;  Zhong, Y.;  Ma, H. T.;  Pan, X. M.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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