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科研机构
大连理工大学 [30]
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期刊论文 [28]
会议论文 [2]
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2019 [4]
2018 [2]
2017 [2]
2016 [2]
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专题:大连理工大学
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Quantitative Correlation between Electrical Resistivity and Microhardness of Cu-Ni-Mo Alloys via a Short-Range Order Cluster Model
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 页码: 312-320
作者:
Li, Hongming
;
Dong, Chuang
;
Zhao, Yajun
;
Li, Xiaona
;
Zhou, Dayu
收藏
  |  
浏览/下载:120/0
  |  
提交时间:2019/12/02
Electrical resistivity
hardness
cluster-plus-glue-atom model
short-range order
Cu alloys
Strain-induced transformation between vacancy voids and stacking fault tetrahedra in Cu
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2019, 卷号: 158, 页码: 359-368
作者:
Xv, Hongbo
;
Zhao, Jie
;
Ye, Fei
;
Tong, Ke
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  |  
浏览/下载:10/0
  |  
提交时间:2019/12/02
Molecular dynamics
Atomistic simulation
Vacancy cluster
Stacking fault tetrahedra
Volumetric strain
Cu-Ni-Sn-Si alloys designed by cluster-plus-glue-atom model
期刊论文
MATERIALS & DESIGN, 2019, 卷号: 167
作者:
Yu, Q. X.
;
Li, X. N.
;
Wei, K. R.
;
Li, Z. M.
;
Zheng, Y. H.
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  |  
浏览/下载:14/0
  |  
提交时间:2019/12/02
Cu-Ni-Sn
Segregation
Discontinuous precipitation
Solidus-liquidus temperature range
High-temperature stability
Cluster model
Dual-cluster formulas for eutectic-type bulk metallic glasses and experimental verification in Zr-Al-Fe-Cu system
期刊论文
MATERIALS & DESIGN, 2019, 卷号: 183
作者:
Han, Kaiming
;
Wang, Yingmin
;
Qiang, Jianbing
;
Zhang, Hongbin
;
Qin, Shengxue
收藏
  |  
浏览/下载:144/0
  |  
提交时间:2019/12/02
Bulk metallic glasses
Eutectics
Zr-Al-Fe-Cu
Dual-cluster formula
Composition design
Effect of In addition on the properties of Sn-Au-Cu lead-free solder
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Yin, Siqi
;
Huang, Mingliang
;
Chen, Yu
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  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Sn-Au solder
Sn-Au-Cu-In
microstructure
mechanical properties
cluster-phis-glue-atom model
Enhanced thermal stability of Cu alloy films by strong interaction between Ni and Zr (or Fe)
期刊论文
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2018, 卷号: 51
作者:
Zheng, Yuehong
;
Li, Xiaona
;
Cheng, Xiaotian
;
Li, Zhuming
;
Liu, Yubo
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Cu
thin film
resistivity
stability
cluster-plus-glue-atom model
Composition interpretation procedures of bulk metallic glasses via example of Cu64Zr36
期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2017, 卷号: 460, 页码: 125-129
作者:
Dong, Dandan
;
Dong, Chuang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Metallic glasses
Cluster-plus-glue-atom model
Principal cluster
Spherical periodicity
Friedel oscillation
Minor-alloyed Cu-Ni-Si alloys with high hardness and electric conductivity designed by a cluster formula approach
期刊论文
PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, 2017, 卷号: 27, 页码: 467-473
作者:
Li, Dongmei
;
Wang, Qing
;
Jiang, Beibei
;
Li, Xiaona
;
Zhou, Wenlong
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2019/12/03
Cu-Ni-Si alloys
Composition design
Cluster-plus-glue-atom model
Microhardness
Electrical conductivity
Electrical resistivity interpretation of ternary Cu-Ni-Mo alloys using a cluster-based short-range-order structural model
期刊论文
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49, 页码: -
作者:
Li, Hongming
;
Zhao, Yajun
;
Li, Xiaona
;
Zhou, Dayu
;
Dong, Chuang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/09
electrical resistivity
cluster-plus-glue-atom model
short-range order
Cu alloys
ternary alloys
Investigation of a new phase in Cu-containing Fe-Ni alloy for corrosion resistance behavior
期刊论文
14th China International Nanoscience and Technology Symposium / Nano-products Exposition, 2016, 卷号: 172, 页码: 59-65
作者:
Li, Chunyan
;
Li, Baozeng
;
Wang, Yingmin
;
Shi, Yong
;
Dong, Chuang
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/09
Cu-containing Fe-Ni
corrosion-resistant alloy
new phase and double-cluster structure model
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