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CORC

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Bi含量对Cu/Sn-0.3Ag-0.7Cu/Cu微焊点蠕变性能的影响 Effect of Bi content on creep properties of Cu/Sn-0.3Ag-0.7Cu/Cu solder joints 期刊论文
2017, 卷号: 27, 页码: 2545-2551
作者:  姚宗湘[1,2];  罗键[1];  尹立孟[2];  王刚[2];  蒋德平[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/29
Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging 期刊论文
2013, 卷号: 24, 页码: 4881-4887
作者:  Shen, Jun[1];  Tang, Qin[1];  Pu, Yayun[1];  Zhai, Dajun[1];  Cao, Zhongming[1]
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/28
Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints 期刊论文
2012, 卷号: 23, 页码: 14-21
作者:  Wu, Cuiping[1];  Shen, Jun[1];  Peng, Changfei[1]
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/28
Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys 期刊论文
2012, 卷号: 23, 页码: 156-163
作者:  Shen, Jun[1];  Wu, Cuiping[1];  Li, Shizeng[1]
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/28
Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads 期刊论文
2011, 卷号: 22, 页码: 1703-1708
作者:  Chen, Jie[1,2];  Shen, Jun[1];  Xie, Weidong[1];  Liu, Hui[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/28
Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate 期刊论文
2011, 卷号: 22, 页码: 797-806
作者:  Peng, Changfei[1];  Shen, Jun[1];  Xie, Weidong[1];  Chen, Jie[1];  Wu, Cuiping[1]
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/28
Microstructural evolution of intermetallic compounds in Sn-3.5Ag-X (X=0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging 期刊论文
2010, 卷号: 489, 页码: 631-637
作者:  Chen, Jie[1];  Shen, Jun[1];  Lai, Shiqiang[1];  Min, Dong[1];  Wang, Xiaochuan[1]
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/28
Microstructural evolution of intermetallic compounds in Sn-3.5Ag-X (X = 0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging 期刊论文
2010, 卷号: 489, 页码: 631-637
作者:  Chen, Jie[1];  Shen, Jun[1];  Lai, Shiqiang[1];  Min, Dong[1];  Wang, Xiaochuan[1]
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/29
Micro-morphology of intermetallic compounds in rapid solidification Sn2.5Ag0.7Cu solder alloy and its effects on performance of solder joint 期刊论文
2010, 卷号: 20, 页码: 2025-2031
作者:  Zhao, Guo-Ji[1,2];  Zhang, Ke-Ke[3];  Luo, Jian[2]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/29
快速凝固Sn2.5Ag0.7Cu钎料中金属间化合物的形态及对焊点性能的影响 Micro-morphology of intermetallic compounds in rapid solidification Sn2.5Ag0.7Cu solder alloy and its effects on performance of solder joint 期刊论文
2010, 卷号: 20, 页码: 2025-2031
作者:  赵国际[1,2];  张柯柯[3];  罗键[2]
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/28

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