×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
上海微系统与信息技... [23]
内容类型
期刊论文 [23]
发表日期
2011 [2]
2009 [4]
2008 [4]
2007 [6]
2006 [1]
2005 [3]
更多...
学科主题
Engineerin... [3]
Engineerin... [2]
Engineerin... [2]
Engineerin... [2]
Engineerin... [2]
Computer S... [1]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共23条,第1-10条
帮助
限定条件
内容类型:期刊论文
专题:上海微系统与信息技术研究所
第一署名单位
第一作者单位
通讯作者单位
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Design and realization of lake water quality detection system based on wireless sensor networks
期刊论文
2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings.2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings, 2011, 期号: 0, 页码: 4858-4861
Gong, Siliang
;
Wang, YG
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2012/08/23
Design and implementation of low-cost scissors gate control system
期刊论文
2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings.2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings, 2011, 期号: 0, 页码: 4846-4849
Gong, Siliang
;
Xing, T
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2012/08/23
Enhanced surface blistering of germanium with B+/H+ coimplantation
期刊论文
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2009, 卷号: 27, 期号: 3, 页码: 1063-1067
Ma, XB
;
Du, XF
;
Liu, WL
;
Chen, C
;
Song, ZT
;
Lin, CL
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2012/03/24
SILICON
TECHNOLOGY
BORON
A new process for fabricating tip-shaped polymer microstructure array with patterned metallic coatings
期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2009, 卷号: 150, 期号: 2, 页码: 296-301
Zhou, HB
;
Li, G
;
Sun, XN
;
Zhu, ZH
;
Xu, BJ
;
Jin, QH
;
Zhao, JL
;
Ren, QS
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2011/12/17
SCANNING PROBE MICROSCOPY
ATOMIC-FORCE MICROSCOPE
DRUG-DELIVERY
TECHNOLOGY
MICRONEEDLE
ELECTRODES
NEEDLES
CELLS
MOLD
Investigation of On-Chip Soft-Ferrite-Integrated Inductors for RF ICs-Part I: Design and Simulation
期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2009, 卷号: 56, 期号: 12, 页码: 3133-3140
Yang, C
;
Liu, F
;
Wang, X
;
Zhan, J
;
Wang, A
;
Ren, TL
;
Liu, LT
;
Long, HB
;
Wu, ZZ
;
Li, XX
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2011/12/17
PLANAR MAGNETIC-STRUCTURES
SPIRAL INDUCTORS
FILM INDUCTORS
SOLENOID INDUCTORS
MUTUAL IMPEDANCES
GRANULAR FILMS
SELF
TECHNOLOGY
WINDINGS
SILICON
Line laser beam based laser-induced fluorescence detection system for microfluidic chip electrophoresis analysis
期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2009, 卷号: 152, 期号: 2, 页码: 168-175
Xu, BJ
;
Yang, M
;
Wang, H
;
Zhang, HL
;
Jin, QH
;
Zhao, JL
;
Wang, HM
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2011/12/17
CHEMICAL-ANALYSIS SYSTEMS
OPTICAL WAVE-GUIDES
CAPILLARY-ELECTROPHORESIS
BIOPOLYMERS
PERFORMANCE
TECHNOLOGY
FRAGMENTS
Development of Micro Direct Methanol Fuel Cell Systems and Their Possible Applications
期刊论文
PROTON EXCHANGE MEMBRANE FUEL CELLS 8, PTS 1 AND 2, 2008, 卷号: 16, 期号: 2, 页码: 1495-1506
Cao, JY
;
Yuan, T
;
Huang, QH
;
Zou, ZQ
;
Xia, BJ
;
Yang, H
;
Feng, SL
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2011/11/04
DIFFERENT FLOW-FIELDS
OPERATIONAL PARAMETERS
WATER
PERFORMANCE
DMFCS
FABRICATION
TECHNOLOGY
MEMBRANES
DESIGN
PEMFC
Study on Void Growth in Micro-Size SnAg Solder Bump
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2008, 卷号: 37, 期号: 11, 页码: 1903-1907
Lin, XQ
;
Luo, L
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2012/03/24
EUTECTIC SNPB
TIN-LEAD
JOINTS
CU
RELIABILITY
EVOLUTION
COPPER
MICROSTRUCTURE
INTERMETALLICS
TECHNOLOGY
Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3, 页码: 307-313
Lin, XQ
;
Luo, L
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2012/03/24
EUTECTIC SNPB
TIN-LEAD
JOINTS
CU
GROWTH
COPPER
MICROSTRUCTURE
INTERMETALLICS
TECHNOLOGY
MORPHOLOGY
On-chip embedded toroidal solenoid inductors and transformers formed by post-CMOS micromachining techniques
期刊论文
MICROELECTRONIC ENGINEERING, 2008, 卷号: 85, 期号: 4, 页码: 697-703
Gu, L
;
Li, XX
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2011/12/17
TECHNOLOGY
KOH
©版权所有 ©2017 CSpace - Powered by
CSpace