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科研机构
北京大学 [31]
厦门大学 [4]
心理研究所 [1]
内容类型
其他 [36]
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2017 [3]
2016 [8]
2015 [5]
2014 [3]
2013 [2]
2012 [3]
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Dynamic chromatin accessibility modeled by Markov process of randomly-moving molecules in the 3D genome
其他
2017-01-01
Wang, Yinan
;
Fan, Caoqi
;
Zheng, Yuxuan
;
Li, Cheng
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2017/12/03
HI-C DATA
GENE-EXPRESSION
CELL-DIFFERENTIATION
IMAGING REVEALS
ORGANIZATION
ARCHITECTURE
PRINCIPLES
REORGANIZATION
INTERACTOME
ELEMENTS
A 3D Geometry-based Stochastic Channel Model for UAV-MIMO Channels
其他
2017-01-01
Zeng, Linzhou
;
Cheng, Xiang
;
Wang, Cheng-Xiang
;
Yin, Xuefeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
TO-MOBILE CHANNELS
SYSTEMS
How Do Assertions Impact Coverage-based Test-Suite Reduction?
其他
2017-01-01
Chen, Junjie
;
Bai, Yanwei
;
Hao, Dan
;
Zhang, Lingming
;
Zhang, Lu
;
Xie, Bing
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  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
PRIORITIZATION
TOOL
A Newton multigrid method for steady-state shallow water equations with topography and dry areas
其他
2016-01-01
Wu, Kailiang
;
Tang, Huazhong
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  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
Newton method
multigrid
block symmetric Gauss-Seidel
shallow water equation (SWE)
steady-state solution
DISCONTINUOUS GALERKIN METHOD
GAS-KINETIC SCHEME
SOURCE TERMS
WENO SCHEMES
FLOWS
ACCURACY
MESHES
GRIDS
How Does Regression Test Prioritization Perform in Real-World Software Evolution?
其他
2016-01-01
Lu, Yafeng
;
Lou, Yiling
;
Cheng, Shiyang
;
Zhang, Lingming
;
Hao, Dan
;
Zhou, Yangfan
;
Zhang, Lu
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
TEST-SUITE REDUCTION
COVERAGE
A Method of Image-Based Water Surface Reconstruction
其他
2016-01-01
Zou, Ling
;
Qi, Yue
;
Wang, Guoping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Data acquisition
Image-based reconstruction
Water surface reconstruction
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Ma, Shenglin
;
Jin, Yufeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/03
TSV
3D packaging
sidewall insulation
electrical properties
CMP
THROUGH-SILICON VIAS
STACKING TECHNOLOGY
LINER
Stabilization and Utilization of Coupling MOS Capacitance between TSVs
其他
2016-01-01
Fang, Runiu
;
Liu, Huan
;
Miao, Min
;
Sun, Xin
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
Through Silicon Vias
Coupling Capacitance
Varactor
INTEGRATION
Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging
其他
2016-01-01
Meng, Wei
;
Zeng, Qinghua
;
Guan, Yong
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
MEMS packaging
reliability
RDL opening
copper thickness
insulation layer thickness
3D INTEGRATION
METALLIZATION
OPTIMIZATION
SILICON
COPPER
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration
其他
2016-01-01
Liu, Huan
;
Zeng, Qinghua
;
Guan, Yong
;
Fang, Runiu
;
Sun, Xin
;
Su, Fei
;
Chen, Jing
;
Miao, Min
;
Jin, Yufeng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
THROUGH-SILICON VIAS
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