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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15