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Ristretto: An Atomized Processing Architecture for Sparsity-Condensed Stream Flow in CNN 会议论文
Westin Chicago, 2022-10
作者:  Gang Li;  Weixiang Xu;  Zhuoran Song;  Naifeng Jing;  Naifeng Jing
收藏  |  浏览/下载：4/0  |  提交时间：2023/06/21
Use of electrochemistry in mini-/micro-LEDs and VCSELs 会议论文
Virtual, Online, 2022-02-20
作者:  Kang, Jin-Ho;  Elafandy, Rami;  Li, Bingjun;  Song, Jie;  Han, Jung
收藏  |  浏览/下载：22/0  |  提交时间：2022/07/14
Photon counting three-dimensional imaging with a position sensitive micro-channel plate detector 会议论文
Kunming, China, 2021-12-07
作者:  Liu, Yifan;  Sheng, Lizhi;  Liu, Yongan;  Zhao, Baosheng
收藏  |  浏览/下载：35/0  |  提交时间：2022/04/27
Development progress of the prototype long baseline optical interferometer in China 会议论文
California, United States, 2020-12-13
作者:  Xu T(徐腾);  Hou YH(侯永辉);  Hu ZW(胡中文);  Jiang FH(姜方华);  Wu Z(吴桢)
收藏  |  浏览/下载：13/0  |  提交时间：2021/03/30
Laser-Induced Micro SEL Characterization of SRAM Devices 会议论文
San Antonio, TX, United states, July 8, 2019 - July 12, 2019
作者:  Yingqi, Ma;  Jianwei, Han;  Shipeng, Shangguan;  Xiang, Zhu;  Rui, Chen
收藏  |  浏览/下载：33/0  |  提交时间：2019/12/26
High-dimensional one-way quantum processing enabled by optical d-level cluster states 会议论文
Rome, Italy, 2019-04-04
作者:  Kues, Michael;  Reimer, Christian;  Sciara, Stefania;  Roztocki, Piotr;  Islam, Mehedi
收藏  |  浏览/下载：5/0  |  提交时间：2020/06/18
Controllable Micro/nano-fluidic Channel Bonding Process Based on the Expansion Centerline and “Filling-Barrier” Structure 会议论文
杭州, 2018
作者:  Yu Hua;  Jiadong Qi;  Jian Jin;  Si Di
收藏  |  浏览/下载：9/0  |  提交时间：2019/01/31
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Does Universities' Research Output Affect FDI's Location Choice? An Analysis of Universities' Micro Data of China 会议论文
PROCEEDINGS OF THE 10TH (2018) INTERNATIONAL CONFERENCE ON FINANCIAL RISK AND CORPORATE FINANCE MANAGEMENT (FRCFM), 2018-01-01
作者:  Xu Xueliu;  Ran Chenyang;  Wang Qian;  Deng Yuwen
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02

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