CORC

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CORC

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A New High-Temperature Sensing Device by Making Use of TBC Thermistor for Intelligent Propulsion Systems 会议论文
2018 AIAA/IEEE Electric Aircraft Technologies Symposium, EATS 2018
作者:  Li Duan, F.;  Weng, H.;  Ji, Z.;  Hu, M.;  Cao, X.
收藏  |  浏览/下载：33/0  |  提交时间：2019/12/30
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载：32/0  |  提交时间：2017/01/15
Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Rong Sun
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
ELECTRICALLY CONDUCTIVE ADHESIVES BASED ON THERMOPLASTIC POLYURETHANE FILLED WITH CARBON NANOTUBES 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Luo, Jie[1];  Zhao, Yue[2];  Chen, Minghai[3];  Yao, Yagang[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03
SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING 会议论文
2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016-01-01
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03

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