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Characterization of cooling rate and microstructure of rapidly solidified spherical mono-sized sn-1.0ag-0.5cu particles 会议论文
作者:  Hu, Ying-Yan;  Wang, Jun-Feng;  Li, Can;  Li, Jian-Qiang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Preparation and application of Cu-Ag composite preforms for power electronic packaging 会议论文
作者:  Zhang, Dongxiao;  Liu, Shengfa;  Xiang, Hui;  Liu, Li;  Zhou, Zhaoxia
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
Experiment Analysis and Modelling of Compaction Behaviour of Ag60Cu30Sn10 Mixed Metal Powders 会议论文
4th International Conference on Advanced Engineering and Technology (ICAET), Incheon, SOUTH KOREA, DEC 15-17, 2017
作者:  Zhou, Mengcheng;  Huang, Shangyu*;  Liu, Wei;  Lei, Yu;  Yan, Shiwei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
探究Pd掺杂Au、Ag、Cu、Ni团簇的稳定性 会议论文
第十一届全国环境催化与环境材料学术会议, 中国辽宁沈阳, 2018-07-01
作者:  解昭;  钟世钧
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Microstructure and Mechanical Properties of C/C Composite/TC17 Joints with Ag-Cu-Ti Brazing Alloy 会议论文
5TH ANNUAL INTERNATIONAL CONFERENCE ON MATERIAL SCIENCE AND ENGINEERING (ICMSE2017), 2018-01-01
作者:  Cao, Xiujie;  Zhu, Ying;  Guo, Wei;  Peng, Peng;  Ma, Kaituo
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
压力和流体组分对硫酸盐——水体系高温液—液相分离的影响:作用机制和地质意义 会议论文
中国江西南昌, 2017-12-09
作者:  王小林;  万野;  周義明
收藏  |  浏览/下载：16/0  |  提交时间：2018/08/13
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5 Cu flip chip solder interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03

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