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CORC

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Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5 Cu flip chip solder interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/03
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Sun, Hongyu;  Huang, Mingliang
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03
Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Jinqi Xie;  Zhe Zhong;  Kai Zhang;  Matthew M.F. Yuen;  S.W. Ricky Lee
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder 会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:  Ye, Lilei[1];  Chen, Si[2];  Liu, Johan[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/26
Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Cu solder joints 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:  Yan, Xingchen[1];  Zhang, Yichen[2];  Wang, Chunyan[3];  Xu, Kexin[4];  Wang, Junjie[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Study on the electromigration-induced failure mechanism of Sn-3.0 Ag-0.5Cu BGA solder balls 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Qiu, Yan;  Huang, Mingliang;  Wu, Aimin
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Fan, M.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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