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Superconductivity in K-doped triphenylamine 会议论文
Los Angeles, California, 2018
作者:  Di Peng;  Renshu Wang;  Jiafeng Yan;  Kai Zhang;  Huang Ge
收藏  |  浏览/下载：35/0  |  提交时间：2019/01/31
Design a Modified Bi-directional Converter for Solar LED Lighting System 会议论文
作者:  Wang, Yiwang;  Chen, Xiaogao;  Tang, Houjun;  Yang, Yong;  Wen, Huiqing
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/19
High Speed Digital Data Interface for OLED-on-Silicon Micro-Display 会议论文
2018 IEEE INTERNATIONAL CONFERENCE OF INTELLIGENT ROBOTICS AND CONTROL ENGINEERING (IRCE), 2018-01-01
作者:  Cai, Jun[1];  Chen, Xiaofeng[2];  Ji, Yuan[3]
收藏  |  浏览/下载：13/0  |  提交时间：2019/04/22
Design and reliability analysis of a novel laser acupuncture device 会议论文
MECHANISMS OF PHOTOBIOMODULATION THERAPY XIII, 2018-01-01
作者:  Pan, Boan;  Zhong, Fulin;  Zhao, Ke;  Li, Ting
收藏  |  浏览/下载：10/0  |  提交时间：2020/01/03
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
Study on organic/inorganic hybrid light emitting diode 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Xu, Xiaoxue[1];  Chen, Zhangfu[2];  Tang, Zhenyu[3];  Wei, Bin[4];  Yang, Lianqiao[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24
Lifetime Prediction Based On Analytical Multi-Physics Simulation for Light-Emitting Diode (LED) Systems 会议论文
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, GERMANY, 2017-04-03
作者:  Yang, Xi;  Wang, Zili;  Ren, Yi;  Sun, Bo;  Qian, Cheng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Baotan Zhang;  Rong Sun;  Yankang Han;  Pengli Zhu;  Daoqiang(Daniel) Lu
收藏  |  浏览/下载：28/0  |  提交时间：2017/01/15
Application of Nano Silver Sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes 会议论文
作者:  Tao, Mian;  Mei, Yun-Hui;  Lee, S. W. Ricky;  Yun, Feng;  Lu, Guo-Quan
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Improved thermal design of fin heat sink for high-power LED lamp cooling 会议论文
作者:  Huang, Yicang;  Shen, Shengnan;  Li, Hui;  Gu, Yunjie
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05

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