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Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror 会议论文
Kunming, China, 2021-12-07
作者:  Zheng, Xiang-Ke;  Kang, Shi-Fa;  Wang, Peng;  Li, Hua;  Shu, Lin-Sen
收藏  |  浏览/下载：27/0  |  提交时间：2022/04/27
Nano-Twisted Double Helix Carbon Debris Improves the Wear Resistance of Ultra-Thick Diamond-Like Carbon Coatings 会议论文
作者:  Sui, Xudong;  Wang, Xinyu;  Zhang, Shuaituo;  Yan, Mingming;  Li, Wensheng
收藏  |  浏览/下载：26/0  |  提交时间：2020/12/18
Study on tensile properties of composite laminates with gap defects 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Zhang, X. Z.;  Bai, R. X.;  Lei, Z. K.;  Zhu, Y. G.;  Geng, C. H.
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/02
MOLECULAR DYNAMICS SIMULATIONS ON THE TENSILE DEFORMATION AND FAILURE OF A POLYETHYLENE/COPPER INTERFACE 会议论文
Quebec City, CANADA, AUG 26-29, 2018
作者:  Liao LJ(廖丽涓);  Meng CY(孟昶宇);  Huang CG(黄晨光)
收藏  |  浏览/下载：23/0  |  提交时间：2019/04/19
Study of the residual stresses variation into the sandwich structure subjected to thermomechanical loading 会议论文
Xi’an, China, May 30, 2018 - May 31, 2018
作者:  Messaoudi, Khalid;  Bouafia, Farida;  Benkhenafou, Fethi;  Douadji, Lyes;  Du, Wei Wei
收藏  |  浏览/下载：26/0  |  提交时间：2019/06/25
Preparation and Thermal Analysis of the nano-silver/Graphene composite material for packaging module 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Liu, Dongjing[1];  Fan, Yasong[2];  Yan, Haidong[3];  Lin, Haiying[4];  Zhu, Haidong[5]
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/24
Microstructure characterization of lattice defects induced by As ion implantation in HgCdTe epilayers 会议论文
作者:  Shi CZ;  Lin C;  Wei YF;  Chen L
收藏  |  浏览/下载：21/0  |  提交时间：2018/11/20
Surface modification of nano-size SiO2 filler for flip chip underfill applications 会议论文
Harbin
作者:  Gang Li;  yachuan He;  Pengli Zhu;  Tao Zhao;  Rong Sun
收藏  |  浏览/下载：36/0  |  提交时间：2018/02/02
Finite Element Analysis of Bond Line Thickness and Fiber Distribution in Solder Based Thermal Interface Materials 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Satwara, Maulik[1];  Hansson, Josef[2];  Ye, Lilei[3];  Rhedin, Henric[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24
Stress intensity factor of interface crack in the cermet cladding material structure under steady mechanical-thermal coupled loads 会议论文
International Conference on Material Science and Engineering, ICMSE 2016, June 24, 2016 - June 26, 2016
作者:  Yang, Junru;  Chi, Yurong;  Wang, Minglan;  Zhu, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31

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