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Numerical and experimental study of temperature rise effect on copper during equal channel angular pressing 会议论文
Guiyang, China, July 10, 2015 - July 14, 2015
作者:  Guo, Tingbiao;  Cao, Jun;  Ding, Yutian;  Jia, Zhi
收藏  |  浏览/下载:26/0  |  提交时间:2020/11/15
Fabrication of microstructures using the DMD-based modulating projection printing method 会议论文
10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7, 2015 - April 11, 2015
作者:  Yang WG(杨文广);  Yu HB(于海波);  Wang YC(王越超);  Liu LQ(刘连庆)
收藏  |  浏览/下载:22/0  |  提交时间:2015/09/08
Effect of heat treatment on thixoformed AM60B alloy 会议论文
Jinan, China, May 13, 2011 - May 16, 2011
作者:  Huang, Haijun;  Chen, Tijun;  Ma, Ying;  Li, Yuandong;  Hao, Yuan
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/15
Effect of Heat Treatment on Thixoformed AM60B Alloy 会议论文
作者:  Huang, Haijun;  Chen, Tijun;  Ma, Ying;  Li, Yuandong;  Hao, Yuan
收藏  |  浏览/下载:10/0  |  提交时间:2019/11/15
The influence of Mn dopant on the electromagnetic properties of NiCuZn ferrite 会议论文
Ceramics International, 3rd Asian Meeting on Electroceramics (AMEC-3), , Singapore, INSPEC
Xiaohui Wang; Weiguo Qu; Longtu Li; Zhilun Gui
收藏  |  浏览/下载:3/0
Generation of initial microstructures for Monte Carlo Potts model Simulations of quasi-binary grain growth 会议论文
Recrystallization and Grain Growth III, Pts 1 and 2, 3rd International Conference on Recrystallization and Grain Growth, ReX and GG III, Jeju Isl, SOUTH KOREA, Web of Science
Zhang, Y. B.; Godfrey, A.; Miodownik, M. A.; Liu, W.; Liu, Q.
收藏  |  浏览/下载:2/0
Modeling of cube-texture evolution during grain growth in Ni thick-films based on experimental observations 会议论文
Recrystallization and Grain Growth III, Pts 1 and 2, 3rd International Conference on Recrystallization and Grain Growth, ReX and GG III, Jeju Isl, SOUTH KOREA, Web of Science
Zhang, Y. B.; Godfrey, A.; Miodownik, M. A.; Liu, W.; Liu, Q.
收藏  |  浏览/下载:3/0
Dielectric properties of BaTiO/sub 3/-based ceramics sintered in reducing atmospheres prepared from nano-powders 会议论文
Ceramics International, 3rd Asian Meeting on Electroceramics (AMEC-3), , Singapore, INSPEC
Xiaohui Wang; Renzheng Chen; Hui Zhou; Longtu Li; Zhilun Gui
收藏  |  浏览/下载:2/0


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