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CORC

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3D Hierarchically Structured CoS Nanosheets: Li+ Storage Mechanism and Application of the High-Performance Lithium-Ion Capacitors 会议论文
作者:  Wang, Yun-Kai;  Liu, Mao-Cheng;  Cao, Jianyun;  Zhang, Hu-Jun;  Kong, Ling-Bin
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
Electro-deposition of Co-Ni sulfide nanosheet arrays on nickel foam and investigation of the pseudocapacitive performance 会议论文
Harbin, China
作者:  Chao Wang;  Yanbin Shen;  Zijie Song;  Xiaodong Zhu;  Shuhui Yu
收藏  |  浏览/下载：28/0  |  提交时间：2018/02/02
Plasma assisted fabrication of multi-layer graphene/nickel hybrid film as enhanced micro-supercapacitor electrodes 会议论文
17th iumrs international conference in asia, iumrs-ica 2016, qingdao, china, 2016-10-20
作者:  Ding, Q.;  Li, W.L.;  Zhao, W.L.;  Wang, J.Y.;  Xing, Y.P.
收藏  |  浏览/下载：38/0  |  提交时间：2017/04/26
Electrochemical studies of silicon nitride electron blocking layer for all-solid-state inorganic electrochromic device 会议论文
10th International Symposium on Electrochemical Impedance Spectroscopy (EIS), Galicia, SPAIN, 2017-10-20
作者:  Huang, Qingjiao;  Dong, Guobo;  Xiao, Yu;  Diao, Xungang
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
A Point of Care Electrochemical Impedance Spectroscopy Device 会议论文
作者:  Lu, Zhijian;  Wang, Hongyi;  Naqvi, Syed Roomi;  Fu, Houqiang;  Zhao, Yuji
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Nitrogen-doped mesoporous carbon derived from polyaniline 会议论文
Qingdao, China, May 20, 2014 - May 21, 2014
作者:  Zhang, De Yi;  Zheng, Li Wen;  Lei, Long Yan
收藏  |  浏览/下载：15/0  |  提交时间：2020/11/15
Effects of polishing parameters on the evolution of 3-D wafer patterns during CMP 会议论文
Shanghai, China, March 19, 2013 - March 21, 2013
作者:  
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/15
An Improved Chronoamperometry for Electrochemical Real-time PCR Measurement 会议论文
作者:  Chen, Xuhai;  Du, Min
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/21
An analytical model for contact height and contact pressure in chemical mechanical polishing (CMP) for different pattern structure 会议论文
Shanghai, China, March 18, 2012 - March 19, 2012
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：6/0  |  提交时间：2020/11/15
An analytical model of contact pressure caused by 2-D wafer topography in chemical-mechanical polishing process 会议论文
Shanghai, China, March 18, 2012 - March 19, 2012
作者:  Wu, Lixiao
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/15

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