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Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Hao-Ren Wen;  Ya-Qiang Ji;  Matthew M.F. Yuen;  Xian-Zhu Fu;  Rong Song
收藏  |  浏览/下载:14/0  |  提交时间:2017/01/15
Microstructure and mechanical properties of the 2D C/SiC/TC4 joints brazed with Cu-Ti + Mo 会议论文
8th High Temperature Ceramic Matrix Composites Conference, HTCMC 2013, September 22, 2013 - September 26, 2013, Xi'an, Shaanxi, China
Yang H.; Fan S.; Wang X.; Cheng L.; Zhang L.
收藏  |  浏览/下载:16/0  |  提交时间:2015/04/27
Microstructures and properties of Al-Cu-Si brazing foils by melt-spun processing 会议论文
作者:  Yu, Weiyuan;  Lu, Wenjiang;  Li, Nairui
收藏  |  浏览/下载:0/0  |  提交时间:2019/11/15


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