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Research on precision measurement and assembly technology of fery prism 会议论文
Kunming, China, 2020-11-05
作者:  Fu, Xihong;  Li, Libo;  Ma, Nana;  Chou, Xiaoquan;  Kang, Shifa
收藏  |  浏览/下载：70/0  |  提交时间：2021/04/12
Investigations on three-dimensional pore-structure in cementitious materials using metal centrifugation porosimetry and simulation 会议论文
作者:  Qian, Rusheng;  Liu, Guojian;  Liu, Zhiyong;  She, Wei;  Qiao, Hongxia
收藏  |  浏览/下载：7/0  |  提交时间：2020/12/18
The Research of 3D Power Grid Based on Big Data 会议论文
重庆, 2018
作者:  Bing He;  Jin-xing Hu;  Ge Yang
收藏  |  浏览/下载：22/0  |  提交时间：2019/01/31
Fabrication of Degradable Intervertebral Fusion with Good Mechanical Properties and Biocompatibility Based on 3D Printing Technology 会议论文
6th International Conference on Measurement, Instrumentation and Automation (ICMIA), Zhuhai, CHINA, June 29-30, 2017
作者:  Zheng XF(郑雄飞);  Wang HR(王赫然);  Wang Q(王强)
收藏  |  浏览/下载：29/0  |  提交时间：2017/12/02
Modeling Temporal Dynamics and Spatial Configurations of Actions Using Two-Stream Recurrent Neural Networks 会议论文
Honolulu, Hawai, July 22 - July 25 2017
作者:  Wang Hongsong(王洪松);  Wang Liang(王亮);  Liang Wang
收藏  |  浏览/下载：42/0  |  提交时间：2018/01/03
Embedding 3D Geometric Features for Rigid Object Part Segmentation 会议论文
2017 IEEE INTERNATIONAL CONFERENCE ON COMPUTER VISION (ICCV), 2017-01-01
作者:  Song, Yafei;  Chen, Xiaowu;  Li, Jia;  Zhao, Qinping
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Cross-class 3D object synthesis guided by reference examples 会议论文
14th International Conference on Computer Aided design and Computer Graphics, Xian, PEOPLES R CHINA, 2016-02-01
作者:  Su, Xiaoyu;  Chen, Xiaowu;  Fu, Qiang;  Fu, Hongbo
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
3D Geological Modeling in Digital Basin 会议论文
International Conference on Automation, Mechanical and Electrical Engineering (AMEE), Phuket, THAILAND
作者:  Liu, P. G.;  Pan, M.;  Li, Z. L.
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/03
3D Geological Modeling in Digital Basin 会议论文
PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON ELECTRICAL, AUTOMATION AND MECHANICAL ENGINEERING (EAME 2015), 2015-01-01
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收藏  |  浏览/下载：7/0  |  提交时间：2020/01/03
Structure Optimization of Through Silicon Via (TSV) Interconnect as Transmission Channel for 3D Integration 会议论文
2013 5TH IEEE INTERNATIONAL SYMPOSIUM ON MICROWAVE, ANTENNA, PROPAGATION AND EMC TECHNOLOGIES FOR WIRELESS COMMUNICATIONS (MAPE), 2013-01-01
作者:  Rahman, Toyobur;  Yan, Zhaowen;  Miao, Jungang;  Youcef, Hacene
收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06

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