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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文    专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Grain growth kinetics of a Ti plus Nb stabilized 12%Cr ferritic stainless steel at high temperature 会议论文 MECHANICAL, MATERIALS AND MANUFACTURING ENGINEERING, PTS 1-3, 2011-06-20 作者:  Song, Changjiang[1];  Zhu, Liang[2];  Guo, Yuanyi[3];  Li, Kefeng[4];  Sun, Fengmei[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 ferritic stainless steel  grain growth  thermal simulator   The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文 ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS 作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06 Fabrication kinetics and properties of Ni-based nano-arrays embedded in anodic Al2O3 film 会议论文 6th International Conference on Thin Film Physics and Applications, TFPA 2007, 2007-09-25 作者:  Yan, Hao[1];  Zhang, Jiancheng[2];  You, Chenxia[3];  Song, Zhenwei[4];  Yu, Benwei[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/05/06 growth kinetics  Ni-based alloy  nanowires  Al2O3 film   The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文 ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008-09-01 作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06 The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文 ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS 作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06