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CORC

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Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder 会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:  Ye, Lilei[1];  Chen, Si[2];  Liu, Johan[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/26
Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Cu solder joints 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:  Yan, Xingchen[1];  Zhang, Yichen[2];  Wang, Chunyan[3];  Xu, Kexin[4];  Wang, Junjie[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Study on Low Silver Sn-Ag-Cu-P Alloy for Wave Soldering 会议论文
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013-07-15
作者:  Wang, Junjie[1];  Wei, Xicheng[2];  Zhu, Wenqi[3];  Wu, Jian[4];  Wu, Nianzu[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Rui, Manman[1];  Lui, Xiuzhen[2];  Chen, Si[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Ju, Guokui[1];  Bi, Wenzhen[2];  Lin, Fei[3];  Han, Yongjiu[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Luo, Xin[1];  Du, Wenhui[2];  Lu, Xiuzhen[3];  Yamaguchi, Toshikazu[4];  Gavin, Jackson[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Microstructural Evolution of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu Solder Joints During Thermal Aging and Its Effects on Mechanical Properties 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Lin, F.[1];  Bi, W. Z.[2];  Ju, G. K.[3];  Wei, X. C.[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Effect of 3.0wt. %Bi and 0.05wt. %Cr Additions on the Microstructure and Tensile Strength of the Sn3Ag0.5Cu/Cu Solder Joint 会议论文
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010-08-16
作者:  Han, Yongjiu[1];  Lin, Fei[2];  Ju, Guokui[3];  Wei, Xicheng[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Zhang, Lili[1];  Tao, Wenkai[2];  Liu, Johan[3];  Zhang, Yan[4];  Cheng, Zhaonian[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal cycling testing 会议论文
2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26
作者:  Sun, Peng[1];  Andersson, Cristina[2];  Liu, Johan[3];  Andersson, Dag R.[4];  Tegehall, Per-Erik[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10

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