CORC

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CORC

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Fabrication and Characterization of a Carbon Fiber Solder Composite Thermal Interface Material 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Hansson, Josef[1];  Ye, Lilei[2];  Liu, Johan[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
A review of recent progress of thermal interface materials: from research to industrial applications 会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:  Hansson, Josef[1];  Ye, Liley[2];  Rhedin, Henric[3];  Liu, Johan[4]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/26
Carbon nanotube growth on different underlayers for thermal interface material application 会议论文
IMAPS Nordic Annual Conference 2016, 2016-06-05
作者:  Fu, Yifeng[1];  Sun, Shuangxi[2];  Mu, Wei[3];  Ye, Lilei[4];  Leveugle, Elodie[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/26
Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications 会议论文
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2013-09-25
作者:  Zanden, Carl[1];  Luo, Xin[2];  Ye, Lilei[3];  Liu, Johan[4]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/30
Mechanical properties of a novel Nano-Thermal Interface Material 会议论文
2013 13TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2013-08-05
作者:  Peng, Wanli[1];  Zanden, Carl[2];  Ye, Lilei[3];  Lu, Xiuzhen[4];  Liu, Johan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Environmental reliability of nano-structured polymer-metal composite thermal interface material 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Lu, Xiuzhen[1];  Zhuang, Mengke[2];  Zhang, Lei[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Sun, Shuangxi[1];  Mu, Wei[2];  Zhang, Yan[3];  Carlberg, Bjorn[4];  Ye, Lilei[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
Study on the Reliability of Nano-structured Polymer-Metal Composite for Thermal Interface Material 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Zhang, Lei[1];  Luo, Xin[2];  Lu, Xiuzhen[3];  Liu, Johan[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
Study on the Adhesion Strength of New Nano-structured Polymer-Metal Composite for Thermal Interface Material (Nano-TIM) under Different Pressures 会议论文
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08
作者:  Zhang, Lei[1];  Lu, Xiuzhen[2];  Luo, Xin[3];  Carlberg, Bjorn[4];  Zandira, Masoud[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Yue, Cong[1];  Zhang, Yan[2];  Liu, Johan[3];  Cheng, Zhaonian[4];  Fan, Jing-yu[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06

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