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A Survey of Formal Techniques for Hardware/Software Co-verification 会议论文
7th International Congress on Advanced Applied Informatics, IIAI-AAI 2018, Yonago, Japan, 2018-07-08
作者:  Liu, Kun;  Kong, Weiqiang;  Hou, Gang;  Fukuda, Akira
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Design of Operation Reserve Classification System for China Under New Circumstances 会议论文
2018 5TH INTERNATIONAL CONFERENCE ON SYSTEMS AND INFORMATICS (ICSAI), 2018-01-01
作者:  Ma, Jingwei;  Li, Weidong;  Liu, Jiantao;  Wang, Juanjuan;  Xu, Lizhong
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
The Impact of Green Supply Chain Integration on the Triple Bottom Line 会议论文
49th Annual Meeting of the Decision Sciences Institute
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收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
The Effect of University - Industry Collaborative Innovation and Resource Integration 会议论文
ICASS2018
作者:  Li QF(李奇峰);  Chi JM(迟景明)
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Unified Analytical Calculation of Radial Integral in Radial Integration BEM for Non-Homogeneous Problems 会议论文
Chinese Conference on Computational Mechanics in conjunction with International Symposium on Computational Mechanics （Nanjing)
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收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Radial Integration BEM for Solving Convection-Conduction Problems 会议论文
Symposium of the International Association for Boundary Element Methods (Paris, Fracne)
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收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Probabilistic Method for Evaluating Wind Power Heating Improving the Accommodation Capacity of Renewable Energy Power System 会议论文
2018 2ND IEEE CONFERENCE ON ENERGY INTERNET AND ENERGY SYSTEM INTEGRATION (EI2), 2018-01-01
作者:  Ran, Liang;  Yuan, Tiejiang;  Ma, Ming;  Li, Jin;  Jiang, Jiheng
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Shaking table tests for evaluating the damage features under earthquake excitations using smartphones 会议论文
HEALTH MONITORING OF STRUCTURAL AND BIOLOGICAL SYSTEMS XII, 2018-01-01
作者:  Zhao, Xuefeng;  Han, Ruicong;  Loh, Kenneth J.;  Xie, Botao;  Lie, Jinke
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02

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