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CORC

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PCM: A Pairwise Correlation Mining Package for Biological Network Inference 会议论文
2018 Fourteenth International Conference on Intelligent Computing (ICIC 2018)
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收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
PCM: A Pairwise Correlation Mining Package for Biological Network Inference 会议论文
INTELLIGENT COMPUTING THEORIES AND APPLICATION, PT II, 2018-01-01
作者:  Liang, Hao;  Gu, Feiyang;  Sheng, Chaohua;  Duan, Qiong;  Tian, Bo
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/02
Measuring moisture content in a porous insulation package with a finite geometric domain 会议论文
4th International Conference on Building Energy and Environment (COBEE 2018)
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收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Indium Sealing of Metal Shell for Precision Devices Packaging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Xiaodong;  Yu, Xiaoli;  Chen, Xiaoyi;  Luo, Yi
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
A Power Quality Forecast Assessment of Bin-zhou Electrified Railway Based on PSASP 会议论文
China International Conference on Electricity Distribution (CICED), Xian, PEOPLES R CHINA, 2016-08-10
作者:  Zheng, Ting-ting;  Wang, Hai-xia
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/09
Investigation of Thermal Characteristics of a Silicon-Based LED Packaging Module 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Hamidnia, Mohammad;  Zou, Liangliang;  Luo, Yi;  Wang, Xiaodong
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09
Vacuum Fluid Charging and Packaging Technique for Micro Heat Pipes 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Wang, Xiao-dong;  Zou, Liang-liang;  Liu, Gang;  Luo, Yi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/11
Package Security Recorder of Vibration 会议论文
5th International Symposium on Photoelectronic Detection and Imaging (ISPDI) - Fiber Optic Sensors and Optical Coherence Tomography, Beijing, PEOPLES R CHINA, 2013-06-25
作者:  Wang Xiao-na;  Hu Jin-liang;  Song Shi-de
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/11
AN ASSESSMENT METHOD OF HIGH-RISE STRUCTURAL EARTHQUAKE DAMAGE USING MEASURED FLOOR ACCELERATION MESSAGES 会议论文
International Symposium on Innovation and Sustainability of Structures in Civil Engineering (ISISS 2011), Xiamen, PEOPLES R CHINA, 2011-01-01
作者:  He, Chunkai;  Teng, Jun;  Li, Zuohua
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/18
Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package 会议论文
2010 International Conference on Electronic Packaging Technology & High Density Packaging
作者:  Huang ML(黄明亮);  Liu XY(刘晓英)
收藏  |  浏览/下载：0/0  |  提交时间：2019/12/24

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