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CORC

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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Fatigue damage and fracture behavior of metallic glass under cyclic compression 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 717, 页码: 41-47
作者:  Wang, XD;  Qu, RT;  Wu, SJ;  Liu, ZQ;  Zhang, ZF
收藏  |  浏览/下载：18/0  |  提交时间：2018/06/05
Stress corrosion cracking of fusion boundary for 316L/52M dissimilar metal weld joints in borated and lithiated high temperature water 期刊论文
CORROSION SCIENCE, 2017, 卷号: 120, 页码: 219-230
Zhu, Ruolin; Wang, Jianqiu; Zhang, Zhiming; Han, En-Hou
收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17

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