CORC

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CORC

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Subwavelength Chiral Spiral Acoustic Metamaterials for a Robust Topological Acoustic Insulator 期刊论文
APPLIED SCIENCES-BASEL, 15, 2022, 卷号: 12, 页码: 7778
作者:  Yang T(杨洮);  Chen M(陈猛);  Xiao BY(肖伯雅);  Liu Y(刘宇);  Jiang H(姜恒)
收藏  |  浏览/下载：18/0  |  提交时间：2022/10/23
Time-Domain Aeroelasticity Analysis by a Tightly Coupled Fluid-Structure Interaction Methodology 期刊论文
APPLIED SCIENCES-BASEL, 12, 2021, 卷号: 11, 页码: 5389
作者:  Liu ZY(刘忠宇);  Nie XY(聂雪媛);  Zheng GN(郑冠男);  Yang GW(杨国伟)
收藏  |  浏览/下载：7/0  |  提交时间：2022/10/25
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
作者:  
收藏  |  浏览/下载：14/0  |  提交时间：2018/12/25
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Engineering Gold Nanorod-Copper Sulfide Heterostructures with Enhanced Photothermal Conversion Efficiency and Photostability 期刊论文
SMALL, 2018, 卷号: 14, 期号: 12, 页码: -
作者:  
收藏  |  浏览/下载：18/0  |  提交时间：2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
3D Mesoporous van der Waals Heterostructures for Trifunctional Energy Electrocatalysis 期刊论文
ADVANCED MATERIALS, 2018, 卷号: 30, 期号: 5, 页码: -
作者:  Tang, C;  Zhong, L;  Zhang, BS;  Wang, HF;  Zhang, Q
收藏  |  浏览/下载：17/0  |  提交时间：2018/06/05
A superior interfacial reliability of Fe-Ni UBM during high temperature storage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
Gao, Li-Yin; Li, Cai-Fu; Wan, Peng; Liu, Zhi-Quan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17

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