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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan
收藏  |  浏览/下载:16/0  |  提交时间:2020/11/14
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:21/0  |  提交时间:2020/11/14
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin
收藏  |  浏览/下载:5/0  |  提交时间:2020/11/14
Preparation of High Stability Pd/Ceramic/Ti-Al Alloy Composite Membranes by Electroless Plating 期刊论文
FRONTIERS IN CHEMISTRY, 2020, 卷号: 8
作者:  Zhang, Dongqiang;  Zhao, Jing;  Yang, Ping;  Chen, Yanan;  Fan, Yiqun
收藏  |  浏览/下载:8/0  |  提交时间:2022/03/01
Multilayer boron nitride nanofilm as an effective barrier for atomic oxygen irradiation 期刊论文
Applied Surface Science, 2020, 卷号: 504
作者:  Cheng, Li;  Shi, Yanbin;  Hao, Yu;  Li, Wensheng;  Ren, Siming
收藏  |  浏览/下载:15/0  |  提交时间:2020/11/14


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