QQ客服 官方微博 反馈留言

浏览/检索结果: 共14条，第1-10条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Grain orientation  Electromigration  Intermetallic compounds  Diffusion   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：6/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15 Ultrasonic-assisted soldering  interfacial intermetallic compounds  microstructure  tin solder   Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 SAC305 lead-free solders  Interfacial reaction  Intermetallic compound  Shear strength  Fracture   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文 MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18 作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua 收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02 62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling   Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7 作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin;  Li, Shuang 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15 lead-free solder  Sn-Cu solder alloy  intermetallics  microstructure   Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562 作者:  Wang, Haozhong;  Hu, Xiaowu;  Li, Qinglin;  Qu, Min 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 Binary alloys  Coarsening  Copper  Growth rate  Morphology  Nanoparticles  Rate constants  Soldered joints  Tin alloys  Aging time  Cu substrate  IMC layer  Inhibition effect  Isothermal aging  Lead-free solder joint  Nanoparticle (NPs)  Solder joints   Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Binary alloys  Geometry  Intermetallics  Lead-free solders  Morphology  Polychlorinated biphenyls  Silver compounds  Soldered joints  Tin alloys  Aging time  Compressive strain  Enhanced effects  Growth of intermetallics  Kirkendall void  Mean diameter  Polyhedron shapes  Solder joints   Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：9/0  |  提交时间：2019/11/15