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Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1671-1680
作者:  Zhou, Liying;  Feng, Shaobo;  Sun, Mingyue;  Xu, Bin;  Li, Dianzhong
收藏  |  浏览/下载:11/0  |  提交时间:2021/02/02
New two-dimensional phase of tin chalcogenides: Candidates for high-performance thermoelectric materials 期刊论文
PHYSICAL REVIEW MATERIALS, 2019, 卷号: 3, 期号: 1, 页码: 9
作者:  Dong, Baojuan;  Wang, Zhenhai;  Hung, Nguyen T.;  Oganov, Artem R.;  Yang, Teng
收藏  |  浏览/下载:1/0  |  提交时间:2021/02/02


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