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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829 作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai 收藏  |  浏览/下载：75/0  |  提交时间：2018/05/31 Component Architectures  Semiconductor Device Packaging   Eye-safe light source and electronic device 专利 专利号: WO2018021414A1, 申请日期: 2018-02-01, 公开日期: 2018-02-01 作者:  ITOH, SHIN 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31 MOlecular MAterials Property Prediction Package (MOMAP) 1.0: a software package for predicting the luminescent properties and mobility of organic functional materials 期刊论文 MOLECULAR PHYSICS, 2018, 卷号: 116, 期号: 7-8, 页码: 1078-1090 作者:  Niu, Yingli;  Li, Wenqiang;  Peng, Qian;  Geng, Hua;  Yi, Yuanping 收藏  |  浏览/下载：68/0  |  提交时间：2019/04/09 Molecular Materials  Luminescence  Charge Transport  First Principle   Indium Sealing of Metal Shell for Precision Devices Packaging 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Xiaodong;  Yu, Xiaoli;  Chen, Xiaoyi;  Luo, Yi 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 package of precision device  indium sealing  shell sealing equipment  simulation   Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 - 收藏  |  浏览/下载：8/0  |  提交时间：2020/01/03 reactive adhesive tape  thermal conductivity  shear strength  calender method   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 LED  Chip scale package  Phosphor/silicone composites  Viscosity  Optimal cure process