CORC

在结果中检索

CORC

浏览/检索结果: 共16条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Design and Implementation of a Compact 3D Stacked RF Front-End Module for Micro Base Station 期刊论文
IEEE Transactions on Components Packaging and Manufacturing Technology, 2018
作者:  Wan LX(万里兮);  Tian GX(田更新);  Li J(李君);  Hou FZ(侯峰泽);  Zhang WW(张文雯)
收藏  |  浏览/下载：26/0  |  提交时间：2019/04/25
Core-shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction. 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2018
作者:  Liu, Shaoqing;  Zhao, Bo;  Jiang, Li;  Zhu, Yan-Wu;  Fu, Xian-Zhu
收藏  |  浏览/下载：12/0  |  提交时间：2019/01/31
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, CA, United states, 2018-05-29
作者:  Huang, M.L.;  Zou, L.;  Yin, S.Q.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Preparation of Hydrogel Material for 3D Bioprinting 会议论文
作者:  Yan, Jia;  Xiao, Yonghao;  Hu, Kun;  Pan, Shun;  Wang, Yulong
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/21
Lightweight and highly efficient electromagnetic wave-absorbing of 3D CNTs/GNS@CoFe2O4 ternary composite aerogels 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: Vol.768, 页码: 6-14
作者:  Ren, Fang;  Guo, Zhengzheng;  Shi, Yanfei;  Jia, Lichuan;  Qing, Yuchang
收藏  |  浏览/下载：8/0  |  提交时间：2019/02/25
Facile preparation of 3D regenerated cellulose/graphene oxide composite aerogel with high-efficiency adsorption towards methylene blue 期刊论文
JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2018, 卷号: Vol.532, 页码: 58-67
作者:  Ren, Fang;  Li, Zhen;  Tan, Wen-Zhen;  Liu, Xiao-Hui;  Sun, Zhen-Feng
收藏  |  浏览/下载：1/0  |  提交时间：2019/02/25

©版权所有 ©2017 CSpace - Powered by CSpace