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CORC

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Evaluation of electroplated Co-Cu metallic coatings for intermediate-temperature solid oxide fuel cells 期刊论文
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2018, 卷号: 43, 期号: 49, 页码: 22458-22466
作者:  Zhang, X.;  Zhang, H. L.;  Yang, X. G.;  Zeng, C. L.
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Cyclic oxidation behavior of a multilayer composite coating for single-crystal superalloys 期刊论文
CORROSION SCIENCE, 2018, 卷号: 145, 页码: 26-34
作者:  Ren, P;  Yang, YF;  Li, W;  Zhu, SL;  Wang, FH
收藏  |  浏览/下载：41/0  |  提交时间：2018/12/25
Cyclic oxidation behavior of a multilayer composite coating for single-crystal superalloys 期刊论文
CORROSION SCIENCE, 2018, 卷号: 145, 页码: 26-34
作者:  Ren, Pan;  Yang, Yingfei;  Li, Wei;  Zhu, Shenglong;  Wang, Fuhui
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Ru-induced microstructural change in ion-plated TiN coating and its tribological properties 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 354, 页码: 175-183
作者:  Li, BW;  Liu, Q;  Chen, MH;  Niu, YS;  Zhu, SL
收藏  |  浏览/下载：230/0  |  提交时间：2018/12/25
Ru-induced microstructural change in ion-plated TiN coating and its tribological properties 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 354, 页码: 175-183
作者:  Li, Bowen;  Liu, Quan;  Chen, Minghui;  Niu, Yunsong;  Zhu, Shenglong
收藏  |  浏览/下载：108/0  |  提交时间：2021/02/02
Ru-induced microstructural change in ion-plated TiN coating and its tribological properties 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 354, 页码: 175-183
作者:  Li, Bowen;  Liu, Quan;  Chen, Minghui;  Niu, Yunsong;  Zhu, Shenglong
收藏  |  浏览/下载：111/0  |  提交时间：2021/02/02
High-Resolution Transmission Electron Microscopic Study of Various Borides Precipitated in Superalloys 期刊论文
ACTA METALLURGICA SINICA, 2018, 卷号: 54, 期号: 11, 页码: 1503-1524
作者:  Ma Xiuliang;  Hu Xiaobing
收藏  |  浏览/下载：1/0  |  提交时间：2021/02/02
High-Resolution Transmission Electron Microscopic Study of Various Borides Precipitated in Superalloys 期刊论文
ACTA METALLURGICA SINICA, 2018, 卷号: 54, 期号: 11, 页码: 1503-1524
作者:  Ma Xiuliang;  Hu Xiaobing
收藏  |  浏览/下载：1/0  |  提交时间：2021/02/02
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, QS;  Zhang, X;  Li, SJ;  Liu, CZ;  Li, CF
收藏  |  浏览/下载：25/0  |  提交时间：2018/12/25
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, Qingsheng;  Zhang, Xian;  Li, Sujie;  Liu, Chunzhong;  Li, Cai-Fu
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02

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