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Bond and release layer transfer process 专利
专利号: US10164144, 申请日期: 2018-12-25, 公开日期: 2018-12-25
作者:  HENLEY, FRANCOIS J.;  KANG, SIEN;  ZHONG, MINGYU;  LI, MINGHANG
收藏  |  浏览/下载:94/0  |  提交时间:2019/12/24
Discontinuous patterned bonds for semiconductor devices and associated systems and methods 专利
专利号: EP2751831B1, 申请日期: 2018-05-16, 公开日期: 2018-05-16
作者:  SCHELLHAMMER, SCOTT, D.;  ODNOBLYUDOV, VLADIMIR;  FREI, JEREMY, S.
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/24
Composite molded phase change material for thermal energy storage, comprises organic solid-liquid phase change material and coordination cross-linked network polymer formed by complexing polymer compound wit metal ion. 专利
申请日期: 2018-01-01, 公开日期: 2018-06-01
作者:  TANG B FAN X ZHANG Y LV R ZHANG S
收藏  |  浏览/下载:13/0  |  提交时间:2019/12/02
Heat conductive reinforced organic composite-shaped phase change material comprises coordination crosslinkable network polymer, organic solid-liquid phase change material, and heat-conducting intensifier. 专利
申请日期: 2018-01-01, 公开日期: 2018-05-18
作者:  TANG B FAN X ZHANG Y LV R ZHANG S
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/02


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