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Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module 期刊论文
2017, 卷号: 32, 页码: 1431-1441
作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[1,2];  Xu, Shengyou[1];  Jiang, Nan[1]
收藏  |  浏览/下载:7/0  |  提交时间:2019/11/28
Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (EI收录) 期刊论文
IEEE Transactions on Power Electronics, 2017, 卷号: 32, 页码: 1431-1441
作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[2];  Xu, Shengyou[1];  Jiang, Nan[1]
收藏  |  浏览/下载:13/0  |  提交时间:2019/04/24
Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging 期刊论文
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2017, 卷号: 2017
作者:  He, Piaopiao[1];  Zhang, Jinlong[2];  Zhang, Jianhua[3];  Yin, Luqiao[4]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/24


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