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| Advanced MEA with Ultralow Pt loading based on orderd conductive polymers nanowire array 会议论文
沃尔姆（Ulm）, 2016-07-20
作者: 王素力,孙公权; Sun GQ(孙公权)
  收藏 | 浏览/下载：4/0 | 提交时间：2017/10/29 |
| Identifying the Latent Active Patterns Underlying the Dynamic Organization of Human Brain Using Resting-State FMRI 会议论文
Prague, 2016-4-13-2016-4-16
作者: Congying Chu ; Tianzi Jiang
收藏 | 浏览/下载：13/0 | 提交时间：2016/07/21
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| Nano artifical red cells with sufficient oxygen supply for boosted photodynamic therapy 会议论文
SIPCD2016(Fourth Symposium on Innovative Polymers for Controlled Delivery), 中国苏州
作者: Zhenyu Luo; Mingbin Zheng; Pengfei Zhao; Ze Chen; Lintao Cai
收藏 | 浏览/下载：21/0 | 提交时间：2017/01/16 |
| Orthodontic Force Simulation of Tooth-PDL-Bone Complex under Archwire Loading 会议论文
EMBC 2016, Orlando, USA
作者: Xinwen Zhou; Zeyang Xia; Yangzhou Gan; Dongxia Zhang; Jing Xiong
收藏 | 浏览/下载：26/0 | 提交时间：2017/01/15 |
| Placenta chondroitin sulfate A binding peptide modified dendrigraft poly-L-lysinesloaded with endophytic bacteria prodigiosin for targeted choriocarcinoma therapy 会议论文
The 4th SKLRB Symposium on Reproductive Biology, 中国北京
作者: Dan Li; Guogang Cheng; Kai Zhao; Jie Chen; Baobei Wang
收藏 | 浏览/下载：21/0 | 提交时间：2017/01/16 |
| Enhanced dielectric performance of PVDF composites with Graphene-BaTiO3 nanohybrids as fillers 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Yunming Li; Wenhu Yang; Xiaodong Gao; Chengliang Li; Shuhui Yu
收藏 | 浏览/下载：14/0 | 提交时间：2017/01/15 |
| Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Yanbin Shen; Chengliang Li; Suibin Luo; Shuhui Yu; Rong Sun
收藏 | 浏览/下载：14/0 | 提交时间：2017/01/15 |
| Novel Underfill Material Having Low Coefficeint of Thermal Expansione 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Zhang Baotan; Sun Rong; Zhu Pengli
收藏 | 浏览/下载：16/0 | 提交时间：2017/01/15 |
| Comparative study of anhydride-based and amine-based underfill materials for flip chip applications 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Gang Li; Pengli Zhu; Qian Guo; Tao Zhao; Daniel Lu
收藏 | 浏览/下载：13/0 | 提交时间：2017/01/15 |
| Underfill Technology for Fine Pitch Flip Chip Application 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Pengli Zhu; Gang Li; Qian Guo; Tao Zhao; Daoqiang Lu
收藏 | 浏览/下载：41/0 | 提交时间：2017/01/15 |
