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Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文
2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore
作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Zhongcai Niu;  Wenqi Zhang
收藏  |  浏览/下载:31/0  |  提交时间:2015/09/01
A Novel 1.2–V 4.5-ppm/°C Curvature-Compensated CMOS Bandgap Reference 期刊论文
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2014
作者:  Bill Ma;  Fengqi Yu
收藏  |  浏览/下载:85/0  |  提交时间:2015/09/01


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