Effect of Surface Interactions on Adhesion of Electrospun Meshes on Substrates

	Effect of Surface Interactions on Adhesion of Electrospun Meshes on Substrates
	Shi, Qiang ; Fan, Qunfu ; Xu, Xiaodong ; Ye,Wei ; Hou,Jianwen ; Wong,Shing-Chung ; Yin,Jinghua
刊名	langmuir
	2014
卷号	30 期号:45 页码:13549-13555
关键词	POLYMER FIBERS FRICTION PEG NANOFIBERS MEMBRANE PLA
通讯作者	shi,q
英文摘要	despite the importance of adhesion between electrospun meshes and substrates, the knowledge on adhesion mechanism and the v method to improve the adhesion remain limited. here, we precisely design the model system based on electrospun poly(ethylene oxide) (peo) meshes and the substrate of styrene-b-(ethylene-co-butylene)-b-styrene elastomer (sebs), and quantitatively measure the adhesion with a weight method. the surfaces of sebs with different roughness are obtained by casting sebs solution on the smooth and rough glass slides, respectively. then, the surfaces of casted sebs are respectively grafted with peg oligomers and long peg chains much larger than the entanglement molecular weight by surface-initiated atom transfer radical polymerization (s1-atrp) of poly(ethylene glycol) methyl ether methacrylate (pegma). the detached surfaces of sebs and dectrospun fibers after adhesion measurements are analyzed by scanning electron microscopy (sem). the adhesive force and adhesion energy are found to lie in the range from 68 to 220 mn and from 12 to 46 mj/m(2), respectively, which are slightly affected by surface roughness of substrate but mainly determined by surface interactions. just as the chemical cross linking induces the strong adhesion, the chain entanglements on the interface lead to the higher adhesion than those generated by hydrophilic hydrophobic interactions and hydrophilic interactions. the long grafted chains and the enhanced temperature facilitate the chain entanglements, resulting in the strong adhesive force. this work sheds new light on the adhesion mechanism at molecular level, which may be helpful to improve the adhesion between the electrospun fibers and substrates in an environmentally friendly manner.
收录类别	SCI
语种	英语
公开日期	2015-10-27
内容类型	期刊论文
源URL	[http://ir.ciac.jl.cn/handle/322003/56267]
专题	长春应用化学研究所_长春应用化学研究所知识产出_期刊论文
推荐引用方式 GB/T 7714	Shi, Qiang,Fan, Qunfu,Xu, Xiaodong,et al. Effect of Surface Interactions on Adhesion of Electrospun Meshes on Substrates[J]. langmuir,2014,30(45):13549-13555.
APA	Shi, Qiang.,Fan, Qunfu.,Xu, Xiaodong.,Ye,Wei.,Hou,Jianwen.,...&Yin,Jinghua.(2014).Effect of Surface Interactions on Adhesion of Electrospun Meshes on Substrates.langmuir,30(45),13549-13555.
MLA	Shi, Qiang,et al."Effect of Surface Interactions on Adhesion of Electrospun Meshes on Substrates".langmuir 30.45(2014):13549-13555.