| Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint | |
| L. M. ; Zhang Yang, Z. F. | |
| 刊名 | Journal of Applied Physics
 |
| 2015 | |
| 卷号 | 117期号:1 |
| 关键词 | ag-cu solder growth behaviors packages lead |
| ISSN号 | 0021-8979 |
| 原文出处 | |
| 公开日期 | 2015-05-08 |
| 内容类型 | 期刊论文 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74001]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. M.,Zhang Yang, Z. F.. Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint[J]. Journal of Applied Physics,2015,117(1). |
| APA | L. M.,&Zhang Yang, Z. F..(2015).Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint.Journal of Applied Physics,117(1). |
| MLA | L. M.,et al."Effect of Y2O3 nanoparticles addition on the microstructure and tensile strength of Cu/Sn3.0Ag0.5Cu solder joint".Journal of Applied Physics 117.1(2015). |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论