Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

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	Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
	M. N. Wang ; J. Q. Wang ; W. Ke
刊名	Journal of Materials Science-Materials in Electronics
	2014
卷号	25 期号:12 页码:5269-5276
关键词	3.5-percent nacl solution electrochemical corrosion polarization characteristics alloys surface joints
ISSN号	0957-4522
原文出处	://WOS:000344809500013
语种	英语
公开日期	2015-01-14
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/73417]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,W. Ke. Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder[J]. Journal of Materials Science-Materials in Electronics,2014,25(12):5269-5276.
APA	M. N. Wang,J. Q. Wang,&W. Ke.(2014).Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.Journal of Materials Science-Materials in Electronics,25(12),5269-5276.
MLA	M. N. Wang,et al."Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder".Journal of Materials Science-Materials in Electronics 25.12(2014):5269-5276.