Residual stress measurement in thin films using a slitting method with geometric phase analysis under a dual beam (FIB/SEM) system

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	Residual stress measurement in thin films using a slitting method with geometric phase analysis under a dual beam (FIB/SEM) system
	Zhu, RH ; Xie, HM ; Dai, XL ; Zhu, JG ; Jin, AZ
刊名	MEASUREMENT SCIENCE & TECHNOLOGY
	2014
卷号	25 期号:9
关键词	residual stress thin film focused ion beam geometric phase analysis finite element model
ISSN号	0957-0233
通讯作者	Zhu, RH (reprint author), Tsinghua Univ, AML, Dept Engn Mech, Beijing 100084, Peoples R China.
中文摘要	Stress generated during thin film deposition is a critical issue for many applications. In general, the possible origins of the residual stress include intrinsic and extrinsic stresses. Since high residual stresses can cause detrimental effects on the film, such as delamination and wrinkle, it is of great importance to quantify the residual stress for the optimal design and the evaluation of its mechanical behavior. In this study, a method combining focused ion beam (FIB) milling and geometric phase analysis (GPA) is developed to assess the residual stress of thin films. The procedures of the residual stress measurement using this method include grating fabrication and slot milling by FIB, high-resolution scanning electron microscope (SEM) imaging of the grating before and after stress relaxation, and deformation analysis by GPA. The residual stress can be inferred from the released deformation using the reference displacements of the finite element model. As an application, this method was utilized to measure the residual stress in a TiAlSiN film, and the measured result is in good agreement with that obtained by the curvature method. In order to analyze the measurement error, the influence factors of Ga+ bombardment and the deposited platinum layer on the stress calculation are also discussed in detail.
语种	英语
公开日期	2015-04-14
内容类型	期刊论文
源URL	[http://ir.iphy.ac.cn/handle/311004/59322]
专题	物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式 GB/T 7714	Zhu, RH,Xie, HM,Dai, XL,et al. Residual stress measurement in thin films using a slitting method with geometric phase analysis under a dual beam (FIB/SEM) system[J]. MEASUREMENT SCIENCE & TECHNOLOGY,2014,25(9).
APA	Zhu, RH,Xie, HM,Dai, XL,Zhu, JG,&Jin, AZ.(2014).Residual stress measurement in thin films using a slitting method with geometric phase analysis under a dual beam (FIB/SEM) system.MEASUREMENT SCIENCE & TECHNOLOGY,25(9).
MLA	Zhu, RH,et al."Residual stress measurement in thin films using a slitting method with geometric phase analysis under a dual beam (FIB/SEM) system".MEASUREMENT SCIENCE & TECHNOLOGY 25.9(2014).