Interface Fracture Behavior Of Electroplated Coating On Metal Substrate Under Compressive Strain
Zhang K(张凯); Zhang K(张坤); Li HX(李怀学); Chen GN(陈光南); Zhang K; Zhang K
刊名Journal of Materials Processing Technology
2009
通讯作者邮箱kaizhang@imech.ac.cn; kzhang@imech.ac.cn
卷号209期号:3页码:1337-1341
关键词Electroplated Coating Interface Fracture Compressive Strain T-Bend Test
ISSN号0924-0136
通讯作者Zhang K
中文摘要The inducement of interface fracture is crucial to the analysis of interfacial adhesion between coating and substrate. For electroplated coating/metal substrate adhering materials with strong adhesion, interface cracking and coating spalling are difficult to be induced by conventional methods. In this paper an improved bending test named as T-bend test was conducted on a model coating system, i.e. electroplated chromium on a steel substrate. After the test, cross-sections of the coated materials were prepared to compare the failure behaviors under tensile strain and compressive strain induced by T-bend test. And the observation results show that coating cracking, interface cracking and partial spalling appear step by step. Based on experimental results, a new method may be proposed to rank the coated materials with strong inter-facial adhesion. (C) 2008 Elsevier B.V. All rights reserved.
类目[WOS]Engineering, Industrial ; Engineering, Manufacturing ; Materials Science, Multidisciplinary
研究领域[WOS]Engineering ; Materials Science
收录类别SCI
语种英语
WOS记录号WOS:000263394000023
公开日期2009-08-03 ; 2009-10-09
内容类型期刊论文
源URL[http://dspace.imech.ac.cn/handle/311007/26736]  
专题力学研究所_先进制造工艺力学重点实验室
通讯作者Zhang K; Zhang K
推荐引用方式
GB/T 7714
Zhang K,Zhang K,Li HX,et al. Interface Fracture Behavior Of Electroplated Coating On Metal Substrate Under Compressive Strain[J]. Journal of Materials Processing Technology,2009,209(3):1337-1341.
APA 张凯,张坤,李怀学,陈光南,Zhang K,&Zhang K.(2009).Interface Fracture Behavior Of Electroplated Coating On Metal Substrate Under Compressive Strain.Journal of Materials Processing Technology,209(3),1337-1341.
MLA 张凯,et al."Interface Fracture Behavior Of Electroplated Coating On Metal Substrate Under Compressive Strain".Journal of Materials Processing Technology 209.3(2009):1337-1341.
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