Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates

	Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates
	Qian Jia 3; Zhixing Mu 2; Xingkai Zhang 3; Bin Zhang 3; Ruixuan Liu 2; Kaixiong Gao 3; Yuanlie Yu 3; Zhenguo Lai 3; Junyan Zhang 3
刊名	Materials Today Chemistry
	2021
期号	21 页码:100521-100532
内容类型	期刊论文
源URL	[http://ir.licp.cn/handle/362003/29979]
专题	兰州化学物理研究所_先进润滑与防护材料研究发展中心
通讯作者	Bin Zhang
作者单位	1.兰州理工大学石油化工学院 2.山西大学分子科学研究所晶体材料研究所 3.中国科学院兰州化学物理研究所，材料磨损与防护科技重点实验室
推荐引用方式 GB/T 7714	Qian Jia,Zhixing Mu,Xingkai Zhang,et al. Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates[J]. Materials Today Chemistry,2021(21):100521-100532.
APA	Qian Jia.,Zhixing Mu.,Xingkai Zhang.,Bin Zhang.,Ruixuan Liu.,...&Junyan Zhang.(2021).Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates.Materials Today Chemistry(21),100521-100532.
MLA	Qian Jia,et al."Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates".Materials Today Chemistry .21(2021):100521-100532.