Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties

CORC > 兰州化学物理研究所 > 中国科学院兰州化学物理研究所 > 先进润滑与防护材料研究发展中心

	Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties
	Wang QH(王齐华); Wang C(王超); Wang TM(王廷梅)
刊名	Journal of Colloid and Interface Science
	2013
卷号	389 页码:99-105
关键词	Dielectric constant Macroporous polyimide films Template Triple-layer structure
ISSN号	0021-9797
通讯作者	王超 ; 王廷梅
英文摘要	In the paper, controllable low dielectric macroporous polyimide (PI) films were prepared using silica microspheres as template, based on the solvent-evaporation-assisted in situ self-assembly of polyamic acid (PAA, precursor of PI) and silica microspheres in N,N-Dimethylformamide (DMF) solution. The interior microstructure of the macroporous PI films and its relationship with mechanical and dielectric properties were investigated. It was found that the macroporous PI films had triple-layer porous structures: ordered porous surface, dense layer in the middle, and interconnected porous structure at the bottom. The thickness of the dense layer in the middle changed with increasing weight content of silica. When SiO₂ wt% was above 40%, the dense layer nearly disappeared. The interconnected porous structure at the bottom was quite homogenous, and the pore size could be controlled by the diameter of silica microspheres. Based on the experimental results, possible formation mechanism of the macroporous PI films was addressed. The mechanical properties of the macroporous PI films were degraded due to the introduction of air void. It was found that the degradation of mechanical properties of macroporous PI films with porosity of 37% is more obvious than that of PI films with porosity below 31%, which could be attributed to the triple-layer microstructure of the films. The air void introduction could effectively reduce the dielectric constant from 4.11 of PI dense films to 2.57 of porous PI films with porosity of 37%. The dielectric constant was only closely related to porosity and had no obvious connection with pore size.
学科主题	材料科学与物理化学
收录类别	SCI
资助信息	the National Science Foundation for Distinguished Young Scholars of China (Grant No. 51025517);the National Defense Basic Scientific Research Project (A1320110011)
语种	英语
WOS记录号	WOS:000310763900014
公开日期	2013-12-03
内容类型	期刊论文
源URL	[http://210.77.64.217/handle/362003/4374]
专题	兰州化学物理研究所_先进润滑与防护材料研究发展中心兰州化学物理研究所_固体润滑国家重点实验室
作者单位	Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
推荐引用方式 GB/T 7714	Wang QH,Wang C,Wang TM. Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties[J]. Journal of Colloid and Interface Science,2013,389:99-105.
APA	Wang QH,Wang C,&Wang TM.(2013).Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties.Journal of Colloid and Interface Science,389,99-105.
MLA	Wang QH,et al."Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties".Journal of Colloid and Interface Science 389(2013):99-105.