Wetting and sealing of the interface between silicate glass and copper | |
Zhang, Min1; Chen, Changjun1,2; Li, Chuangye2 | |
刊名 | International Journal of Materials Research
![]() |
2019-02-01 | |
卷号 | 110期号:2页码:163-173 |
关键词 | Chemical analysis Contact angle Copper Energy dispersive spectroscopy Glass Scanning electron microscopy Sealing (finishing) Silicates Surface roughness Temperature Chemical compositions Effects of temperature Element distribution Energy dispersive X ray spectroscopy Holding temperatures Increasing temperatures Wetting behavior Wetting property |
ISSN号 | 18625282 |
DOI | 10.3139/146.111723 |
英文摘要 | In order to realize reliable sealing and combining of constructional glass and copper, the effects of temperature, holding time, and roughness on their wetting properties were studied. The contact angle and drop diameter were measured by microscopy. The microstructure, element distribution and chemical composition of the reaction interface were analyzed by scanning electron microscopy and energy dispersive X-ray spectroscopy to reveal the relationship between the contact angle and the reaction interface. The results show that the glass/copper contact angle of the sample tested constantly decreases with increasing temperature. If the holding temperature is increased from 980 8C to 990 8C, and the wetting angle is reduced from 83.228 to 55.288. When the holding time is prolonged from 5 min to 40 min at 1 000 8C, the wetting angle decreases and the size of the black halo around the glass reduces. The copper surface roughness has little effect on the wetting angle. Therefore, during the actual sealing process, increasing the temperature and holding time, could effectively improve the wetting behavior of the glass and copper. The black halo formation and interfacial reaction mechanism are also discussed. © Carl Hanser Verlag GmbH & Co. KG. |
WOS研究方向 | Metallurgy & Metallurgical Engineering |
语种 | 英语 |
出版者 | Carl Hanser Verlag |
WOS记录号 | WOS:000458405900010 |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/150514] ![]() |
专题 | 图书馆 |
作者单位 | 1.State Key Laboratory of Advanced Processing and Recycling of Non–ferrous Metals, Lanzhou University of Technology, Lanzhou, Gansu, China; 2.Laser Processing Research Center, School of Mechanical and Electric Engineering, Soochow University, No. 8, Jixue Road, Suzhou Jiangsu; 215021, China |
推荐引用方式 GB/T 7714 | Zhang, Min,Chen, Changjun,Li, Chuangye. Wetting and sealing of the interface between silicate glass and copper[J]. International Journal of Materials Research,2019,110(2):163-173. |
APA | Zhang, Min,Chen, Changjun,&Li, Chuangye.(2019).Wetting and sealing of the interface between silicate glass and copper.International Journal of Materials Research,110(2),163-173. |
MLA | Zhang, Min,et al."Wetting and sealing of the interface between silicate glass and copper".International Journal of Materials Research 110.2(2019):163-173. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论