Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate

doi:10.1007/s10854-020-04882-7

	Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
	Sun, Xuemin 1; Yu, Weiyuan 1; Wang, Fengfeng 1; Wang, Yanhong 2
刊名	Journal of Materials Science: Materials in Electronics
	2021
卷号	32 期号:1 页码:1073-1079
关键词	Copper Tin Ultrasonic effects Ultrasonic testing Ultrasonic waves Wetting Acoustic cavitations Additional forces Copper substrates Cross-section morphology Interfacial atoms Ultrasonic sound Ultrasonic vibration Wetting balance methods
ISSN号	09574522
DOI	10.1007/s10854-020-04882-7
英文摘要	The wetting behavior of molten tin solder on copper substrate under ultrasonic vibrations was investigated by the wetting balance method at 250 °C. The cross-section morphology and microstructure of the specimen were analyzed after the wetting test. The grain size and thickness of intermetallic compounds (IMCs) at the interface were measured by an image-pro software. The ultrasonic sound pressure distribution in the molten tin solder was simulated by finite element analysis. The results showed significant effect of ultrasonic vibrations on the wettability of the molten tin solder on the copper substrate. The wettability was conjunctively determined by the driving and additional forces caused by an interfacial reaction and acoustic streaming, respectively. Acoustic cavitation expedited the interaction of interfacial atoms and facilitated the interfacial reaction, resulting in an increased driving force that contributed to the spreading of the molten tin solder on the copper substrate. © 2021, Springer Science+Business Media, LLC, part of Springer Nature.
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	Springer
WOS记录号	WOS:000604257300005
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/147204]
专题	实验室建设与管理处土木工程学院
作者单位	1.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Gansu Province, Lanzhou University of Technology, Lanzhou; 730050, China; 2.School of Civil Engineering, Gansu Province, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Sun, Xuemin,Yu, Weiyuan,Wang, Fengfeng,et al. Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate[J]. Journal of Materials Science: Materials in Electronics,2021,32(1):1073-1079.
APA	Sun, Xuemin,Yu, Weiyuan,Wang, Fengfeng,&Wang, Yanhong.(2021).Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate.Journal of Materials Science: Materials in Electronics,32(1),1073-1079.
MLA	Sun, Xuemin,et al."Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate".Journal of Materials Science: Materials in Electronics 32.1(2021):1073-1079.