Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires

doi:10.1002/adem.202200037

	Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
	Sun, Pengfei 1,2; Li, Zhiwei 3; Hou, Jiapeng 1; Xu, Aimin 3; Wang, Qiang 1; Zhang, Yi 3; Zhang, Zhenjun 1; Zhang, Penglin 2; Zhang, Zhefeng 1
刊名	ADVANCED ENGINEERING MATERIALS
	2022
关键词	annealing electrical conductivity microstructure evolution oxygen-free copper wire strength
ISSN号	1438-1656
DOI	10.1002/adem.202200037
英文摘要	In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen-free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low-temperature region (80-150 degrees C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high-temperature region (above 210 degrees C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.
WOS研究方向	Materials Science
语种	英语
出版者	WILEY-V C H VERLAG GMBH
WOS记录号	WOS:000773409700001
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/158118]
专题	材料科学与工程学院
作者单位	1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China; 3.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Peoples R China
推荐引用方式 GB/T 7714	Sun, Pengfei,Li, Zhiwei,Hou, Jiapeng,et al. Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires[J]. ADVANCED ENGINEERING MATERIALS,2022.
APA	Sun, Pengfei.,Li, Zhiwei.,Hou, Jiapeng.,Xu, Aimin.,Wang, Qiang.,...&Zhang, Zhefeng.(2022).Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires.ADVANCED ENGINEERING MATERIALS.
MLA	Sun, Pengfei,et al."Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires".ADVANCED ENGINEERING MATERIALS (2022).