Microstructure and properties of tungsten copper composite material

doi:10.4028/www.scientific.net/MSF.788.646

CORC > 兰州理工大学 > 兰州理工大学

	Microstructure and properties of tungsten copper composite material
	Guo, Ting Biao; Zhao, Jun Yuan; Ding, Yu Tian
	2014
会议日期	September 22, 2013 - September 28, 2013
会议地点	Qingdao, China
关键词	Binary alloys Copper alloys Hardness Microstructure Sintering Tungsten alloys Copper tungstens Hardness values Microstructure and properties SEM analysis Solid phase sintering Theoretical density Tungsten content Tungsten-copper composites
卷号	788
DOI	10.4028/www.scientific.net/MSF.788.646
页码	646-651
英文摘要	The copper-tungsten system in the liquid and solid phase is completely immiscible. In this paper, the powder solid-phase sintering method was used to prepare the copper-tungsten composites of different compositions (CuxWy, x=63, 78, 84, 87, 90, 91, y=37, 22, 16, 13, 10, 9 (x+y=100)). By XRD and SEM analysis of the sample microstructure, the trend of the ratio of the conductivity, density and hardness of the samples with different ratio were determined. The results show that with the increasing tungsten content, the conductivity of the copper-tungsten composite increases, whereas the amplitude reduces. The actual density of the sample is smaller than its theoretical density. The more the tungsten content is, the smaller its hardness value. © (2014) Trans Tech Publications, Switzerland.
会议录	Materials Science Forum
会议录出版者	Trans Tech Publications Ltd
语种	英语
ISSN号	02555476
内容类型	会议论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/117329]
专题	兰州理工大学
作者单位	State key lab. of Gansu Advanced Non-ferrous Metal Materials, Lanzhou Univ of Tech, Lanzhou 730050, China
推荐引用方式 GB/T 7714	Guo, Ting Biao,Zhao, Jun Yuan,Ding, Yu Tian. Microstructure and properties of tungsten copper composite material[C]. 见:. Qingdao, China. September 22, 2013 - September 28, 2013.