Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties

	Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties
	Yang, Jing 2; Tao, Liming 1; Cao, Pengrui 1; Yang, Zenghui 1; Zhang, Xinrui 1; Wang, Qihua 1; Wang, Tingmei 1; Luo, Heming 2; Zhang, Yaoming 1
刊名	MACROMOLECULAR MATERIALS AND ENGINEERING
	2021-06
卷号	30 期号:8 页码:2100185
语种	英语
WOS记录号	WOS:000659808400001
内容类型	期刊论文
源URL	[http://ir.licp.cn/handle/362003/27674]
专题	兰州化学物理研究所_先进润滑与防护材料研究发展中心
通讯作者	Luo, Heming; Zhang, Yaoming
作者单位	1.中国科学院兰州化学物理研究所 2.Lanzhou Univ Technol, Coll Petrochem Technol,
推荐引用方式 GB/T 7714	Yang, Jing,Tao, Liming,Cao, Pengrui,et al. Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties[J]. MACROMOLECULAR MATERIALS AND ENGINEERING,2021,30(8):2100185.
APA	Yang, Jing.,Tao, Liming.,Cao, Pengrui.,Yang, Zenghui.,Zhang, Xinrui.,...&Zhang, Yaoming.(2021).Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties.MACROMOLECULAR MATERIALS AND ENGINEERING,30(8),2100185.
MLA	Yang, Jing,et al."Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties".MACROMOLECULAR MATERIALS AND ENGINEERING 30.8(2021):2100185.