Unsupervised Anomaly Detection for Surface Defects with Dual-Siamese Network
Tao X(陶显)3; Da-Peng Zhang3; Ma WZ(马文治)3; Hou ZX(侯占新)2; Lu ZF(逯正峰)2; Chandranath Adak1
刊名IEEE Transactions on Industrial Informatics
2022-01
卷号1期号:1页码:1-11
关键词缺陷检测
ISSN号1551-3203
DOI10.1109/TII.2022.3142326
文献子类长文
英文摘要

Unsupervised anomaly detection in real industrial scenarios is challenging since the small amount of defect-free images contain limited discriminative information, and anomaly defects are unpredictable. In this paper, a dual-siamese network is designed to simultaneously detect and locate anomalies in images. It first uses a pre-trained convolutional neural network (CNN)-based siamese architecture to embed discriminative features of normal samples and synthetic defective samples. A dense feature fusion (DFF) module is employed to obtain the dense feature representation of dual input. The following siamese network of perceptual defects is proposed to reconstruct and restore the dual-dense features of the previous stage. Compared to the existing methods that only employ a single residual map, the restoration of dense feature maps is proposed to locate the anomalies better. The experimental results on the MVTec AD dataset demonstrate that our method achieves state-of-the-art inspection accuracy and has potential for industrial application.

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语种英语
内容类型期刊论文
源URL[http://ir.ia.ac.cn/handle/173211/47200]  
专题精密感知与控制研究中心_精密感知与控制
通讯作者Tao X(陶显)
作者单位1.Indian Institute of Information Technology
2.China University of Mining and Technology - Beijing
3.Institute of Automation, Chinese Academy of Sciences
推荐引用方式
GB/T 7714
Tao X,Da-Peng Zhang,Ma WZ,et al. Unsupervised Anomaly Detection for Surface Defects with Dual-Siamese Network[J]. IEEE Transactions on Industrial Informatics,2022,1(1):1-11.
APA Tao X,Da-Peng Zhang,Ma WZ,Hou ZX,Lu ZF,&Chandranath Adak.(2022).Unsupervised Anomaly Detection for Surface Defects with Dual-Siamese Network.IEEE Transactions on Industrial Informatics,1(1),1-11.
MLA Tao X,et al."Unsupervised Anomaly Detection for Surface Defects with Dual-Siamese Network".IEEE Transactions on Industrial Informatics 1.1(2022):1-11.
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